AMB uses the expertise and technology from the cell sector for the transfer between final cleaning line and wafer inspection system.  A parallel robot with special gripper guarantees a soft and gentle handling of the wafers.

Your benefit

• One system for up to 8 lanes (156 mm x 156 mm)
  
• High throughput
• Reduced breakage rate
• Simple wafer tracking
• Precise and reproducible position accuracy
• Integrated “on the fly” wafer tracking